Robert, Discover the World's Thinnest Light Bulb

Looking Beyond 10 nm FinFETs

Featured in this issue:      Custom Profiles and Forming  |  RF Assemblies for Industrial Applications  |  Qorvo RF Solutions for Connected Cars  |  Low Supply Voltage 1MBd Digital Optocoupler  |  DC-DC Power Supply Design  |  Flexible, Low-jitter Universal Output Buffers  |  AC-DC and DC-DC Power Supplies Shipped in 3 Days  |  Xtra-Guard® Performance Cable 1 July 2015 Share with a friend Add to Safe Senders List |  If you can't view this email, please click here Industry Trends & Events . . .   Learn more   Looking Beyond 10 nm FinFETs Looking at the next node beyond 10 nm FinFETs, IBM researchers based in Zurich, Switzerland and Yorktown Heights, New York have jointly developed a method called template-assisted selective epitaxy (TASE) to build nanowires and multi-gate transistors from III-V compound semiconductors on top of silicon-on-insulator (SOI) wafers. The results of this integration were presented in a paper published in the Journal Applied Physics Letters. Learn more     View now   Custom Profiles and Forming New England Wire Technologies Corporation New England Wire Technologies only manufactures custom designed cable, and custom profiles are a favorite! Our experienced technical staff works directly with the customer to design a product meeting their individual requirements before it is sent to our R&D engineers, who will supervise manufacturing to completion.     Learn more   RF Assemblies for Industrial Applications Carlisle Interconnect Technologies Carlisle Interconnect Technologies is your reliable resource for high-performance RF/Microwave assemblies designed for all industrial applications. Vertical integration and extensive manufacturing capabilities ensure that quality and on-time delivery are never compromised. CarlisleIT provides in-process testing to measure characteristic impedance, capacitance, dielectric withstanding voltage, and time delay mismatch.

Don't Miss This . . .   View now   Locating Discontinued ICs for Older Designs Just because an IC or a semiconductor device is discontinued by its original source does not mean that it is lost forever. There are a few semiconductor manufacturers specialized in making discontinued parts. One of them is Lansdale Semiconductor based in Phoenix, Arizona. The other is Rochester Electronics.     Learn more   Smartphones are Going Modular Like Google's project Ara, Kickstarter-funded startup Nexpaq is also turning a smartphone into a modular product. For that, Nexpaq has developed a modular smartphone case with a built-in MIPI interface to interconnect the add-on modules like an extra battery, amplified speaker, flash drive, laser pointer, and more. The company has raised $279,758 to go into production.   Featured Products . . .   Graphene Enables World's Thinnest Light Bulb Scientists from Columbia Engineering, Seoul National University (SNU), and Korea Research Institute of Standards and Science (KRISS) have jointly created the world's thinnest light bulb. For the first time, the scientists have demonstrated an on-chip visible light source using graphene as a filament. This study was led by Young Duck Kim, a postdoctoral research scientist in James Hone's group at Columbia Engineering.   Learn more     Battery Charger IC Significantly Cuts Charge Time Texas Instruments has released a new integrated single-cell Li-ion battery-charger IC, that utilizes the company's MaxCharge technology to reduce charge time. According to TI, charger designs based on this chip can reduce charge time by up to 60 percent compared to existing battery chargers. Besides maximizing the benefits of a faster charge time, the device also gives users a safer charging experience.   View now   View now   Qorvo RF Solutions for Connected Cars Qorvo (TriQuint + RFMD) Qorvo is an ISO/TS-16949 and AEC Q200-compliant supplier of automotive RF components for satellite radio, collision avoidance systems, telematics wireless systems, infotainment, GPS, and more. Turn to Qorvo for Wi-Fi PAs, LNAs, RF filters, and switch-LNA modules for connected car applications. Learn more: automotive solutions webpage, automotive solutions guide.     Learn more   Low Supply Voltage 1MBd Digital Optocoupler Avago Technologies The Avago ACPL-M51L (single-channel, SO-5 package) is a low power, low supply voltage 1Mbd digital optocoupler, configurable as a 4-pin device. The device uses an insulating layer between the light emitting diode and an integrated photon detector to provide electrical insulation between the input and output. For more information.     DC-DC Power Supply Design Infineon Technologies AG New on-demand webinar: DC-DC Power Supply Design — Is LLC the right choice for you? In case you missed our live webinar, you can now watch it on demand! It introduces the LLC topology and control requirements to design engineers and product managers.   Learn more     Flexible, Low-jitter Universal Output Buffers Integrated Device Technology The 5P1103 and 5P1105 are programmable fanout buffers with universal out­puts and very low additive phase jitter. Configurations can be stored in OTP memory or changed using an I2C interface. The small package and flexible output configuration saves board space, reduces component count, and lowers system cost.   View now

Explore More . . .   View now   Fairchild Makes Dumb MEMS Smarter After about a decade of technological development, Fairchild Semiconductor is now ready to announce its first smart MEMS product based on technology licensed from Sandia National Laboratories called SUMMiT, which stands for Sandia Ultra Planar Multilevel MEMS Technology. The result is a six-axis inertial measurement unit (IMU) with nine-axis sensor fusion algorithms.     Learn more   Nano-accordion Structure Creates Stretchable Conductors Researchers from North Carolina State University have created stretchable, transparent conductors using nano-accordion structures. The researchers created a 3D polymer template on a silicon substrate, which was then coated with a layer of aluminum-doped zinc oxide, and an elastic polymer is applied to the zinc oxide. Next, silicon and the template are removed to realize symmetrical zinc oxide ridges on an elastic substrate.   Noteworthy . . .   Smallest Power Module is Cool Exar has released a new single output, synchronous step-down DC/DC converter module in the industry's smallest footprint. Comprising a power converter with integrated MOSFETs, inductors, and internal input and output capacitors in a compact QFN package, the DC/DC module offers over 93% conversion efficiency and requires no thermal de-rating for output voltages of 1.8 V and below.   Learn more   DSPs Come with Multiple SHARC Cores For applications requiring low power with higher real-time performance, Analog Devices has extended its DSP portfolio with the addition of eight new members. Five of these will feature an ARM Cortex-A5 processor core, while all will be supplied with single or dual SHARC+ cores. This is the first time that ADI has offered DSPs with multiple SHARC cores.   View now     View now   AC-DC and DC-DC Power Supplies Shipped in 3 Days Acopian Power Supplies Acopian manufactures millions of reliable AC-DC and DC-DC power supplies shipped in three days. Programmable, switching, linear, rack mount, wall mount, DIN rail mount, redundant systems, high voltage, and custom power supplies. We offer every voltage from 1 volt to 30 kV and up to 1400 W. Made in the USA.     Learn more   Xtra-Guard® Performance Cable Alpha Wire Alpha Wire's Xtra-Guard® cable brings performance and reliability to the biggest challenges in the toughest environments. No matter what extremes your application faces, you'll find an Xtra-Guard cable that excels in meeting your requirements. Downtime is costly. Make sure your cable lives up to the demands of the application.

Industry Standards . . .   Get the standards   Standard Covers Flexible PCBs This specification, available now from IHS, covers qualification and performance requirements of flexible printed circuit boards. The flexible printed board may be single-sided, double-sided, multilayer, or rigid-flex multilayer. All of these constructions may or may not include stiffeners, plated-through holes, and blind/buried svias. The flexible or rigid-flex printed board may contain build up High Density Interconnect (HDI) layers. For more information on IHS standards, visit us here. Get the standards IHS Engineering360 Past issues Upcoming Events Send to a friend Newsletter Subscriptions Product Alerts Feedback Media Kit Issue 11  | Vol 10 Electronics360  |  Datasheets360  |  CR4 © 2015 IHS. All rights reserved, 30 Tech Valley Drive, Suite 102, East Greenbush, NY 12061 - 800.261.2052. All other products, company names, or other marks appearing in this e-newsletter are the trademarks and property of their respective owners. Please do not reply to this e-mail, as we are unable to respond from this address. If you would like to contact us, please send an email to: GS-newslettercomments@ihs.com To unsubscribe from this e-newsletter, click here. To unsubscribe from all IHS Engineering360 email communications, click here. To edit your user profile, visit Your Profile. If a friend forwarded this e-newsletter and you'd like to receive it in the future, subscribe directly.